Invention Application
US20160043480A1 JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART
审中-公开
接合方法，接头结构，电子器件，制造电子器件和电子部件的方法
- Patent Title: JOINING METHOD, JOINT STRUCTURE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC PART
- Patent Title (中): 接合方法，接头结构，电子器件，制造电子器件和电子部件的方法
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Application No.: US14918648Application Date: 2015-10-21
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Publication No.: US20160043480A1Publication Date: 2016-02-11
- Inventor: Kosuke Nakano , Hidekiyo Takaoka
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2010-287782 20101224; JP2011-159922 20110721
- Main IPC: H01R4/02
- IPC: H01R4/02 ; H01R4/58
Abstract:
A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.
Public/Granted literature
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