公开(公告)号：US09209527B2

公开(公告)日：2015-12-08

申请号：US13904072

申请日：2013-05-29

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K31/00 ,  B23K31/02 ,  H01R4/02 ,  B23K35/02 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

Abstract translation: 一种将具有至少由第一金属构成的表面的第一金属构件与至少具有由第二金属制成的表面的第二金属构件接合在一起的方法。 接合材料包括熔点低于第一金属和/或第二金属的低熔点金属。 组成接合材料的低熔点金属是Sn或含有Sn的合金。 第一金属和第二金属中的至少一个是与低熔点金属形成金属间化合物的金属或合金，并且与金属间化合物的晶格常数差为50％以上。 位于第一金属构件和第二金属构件之间的接合材料在低熔点金属熔化的温度下进行热处理。

公开(公告)号：US20150072165A1

公开(公告)日：2015-03-12

申请号：US14547262

申请日：2014-11-19

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tomohiro Sunaga ,  Daisuke Megumi ,  Yoshihiko Takano ,  Hidekiyo Takaoka

IPC: H05K3/40 ,  B23K35/26 ,  B23K35/02 ,  C25D3/56 ,  C25D5/16

CPC classification number: H05K3/40 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/226 ,  B23K35/262 ,  B23K2101/42 ,  C23C28/02 ,  C23C28/021 ,  C25D3/56 ,  C25D3/58 ,  C25D5/10 ,  C25D5/16 ,  C25D5/18 ,  C25D5/505 ,  C25D21/12 ,  C25D21/14 ,  H05K3/225 ,  H05K3/244 ,  H05K3/341 ,  H05K2201/0338 ,  H05K2203/04 ,  Y10T428/12458

Abstract: A bonding member that includes a plating film containing a Cu—Ni alloy as its main constituent. In this plating film, the Cu mass ratio Cu/(Cu+Ni) is increased and decreased between 0.7 and 0.97 in the film thickness direction. In addition, the amplitude between the increase and decrease in the Cu mass ratio is larger than 0.1. Therefore, when the plating film containing the Cu—Ni alloy as its main constituent and Sn-based solder material or the like are joined by soldering, an intermetallic compound layer with a high melting point is formed. In addition, the plating film has a layer with a slow reaction rate, and thus can slow the reaction rate of alloying reaction between the Cu—Ni alloy and a Sn-based metal.

Abstract translation: 一种接合构件，其包括以Cu-Ni合金为主要成分的镀膜。 在该镀膜中，铜质量比Cu /（Cu + Ni）在膜厚方向上增加0.7〜0.97。 此外，Cu质量比的增加和减小之间的幅度大于0.1。 因此，当通过焊接将包含Cu-Ni合金作为其主要成分的电镀膜和Sn基焊料等接合时，形成具有高熔点的金属间化合物层。 此外，电镀膜具有反应速度慢的层，因此可以降低Cu-Ni合金与Sn系金属之间的合金化反应的反应速度。

公开(公告)号：US20140356055A1

公开(公告)日：2014-12-04

申请号：US14459383

申请日：2014-08-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Yasuyuki Seikmoto ,  Hidekiyo Takaoka ,  Daisuke Tsuruga

IPC: B23K20/00

CPC classification number: B23K20/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/42 ,  C21D9/50 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  Y10T403/478

Abstract: When a first joining object and a second joining object are joined to each other, the first joining object has a first metal composed of Sn or an alloy containing Sn, the second joining object has a second metal composed of an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu. The first joining object and the second joining object are subjected to heat treatment in a state of being in contact with each other to produce an intermetallic compound at an interface between both joining objects such that both joining object are joined to each other. An alloy containing Sn in an amount of 70% by weight or more is used as the first metal. An alloy containing Sn in an amount of 85% by weight or more is used as the first metal.

Abstract translation: 当第一接合对象和第二接合对象彼此接合时，第一接合对象具有由Sn或包含Sn的合金构成的第一金属，第二接合对象具有由包含至少一个选定的合金的合金构成的第二金属 来自Ni，Mn，Al和Cr以及Cu。 第一接合体和第二接合体在彼此接触的状态下进行热处理，以在两接合体之间的界面处形成金属间化合物，使得接合体彼此接合。 使用含有70重量％以上的Sn的合金作为第一金属。 使用含有85重量％以上的Sn的合金作为第一金属。

公开(公告)号：US20140345939A1

公开(公告)日：2014-11-27

申请号：US14460519

申请日：2014-08-15

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K1/00 ,  H01R4/02 ,  H05K13/04

CPC classification number: B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/0216 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/222 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/04 ,  C22C13/00 ,  C22C13/02 ,  H01L21/52 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2924/01322 ,  H01R4/02 ,  H05K3/3436 ,  H05K3/3463 ,  H05K13/0465 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the low melting point metal composing the joining material is Sn or an alloy containing Sn, at least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal composing the joining material, and heat treatment is performed at a temperature at which the low melting point metal melts in a state of locating the joining material between the first metal member and the second metal member.

Abstract translation: 在将由第一金属组成的第一金属构件连接到由第二金属构成的第二金属构件之间插入有接合材料的情况下，所述接合材料包括熔点比第一金属低的熔点低熔点金属和/ 构成接合材料的低熔点金属是Sn或含有Sn的合金，第一金属和第二金属中的至少一种是金属或合金，其与形成金属间化合物的低熔点金属构成， 在第一金属构件和第二金属构件之间的接合材料的定位状态下，在低熔点金属熔融的温度下进行热处理。

公开(公告)号：US20130270001A1

公开(公告)日：2013-10-17

申请号：US13917706

申请日：2013-06-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02

CPC classification number: H01R4/02 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/0425 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

Abstract translation: 一种连接结构，其包括至少Cu-Sn金属间化合物，M-Sn金属间化合物和Cu-M-Sn金属间化合物（其中M为Ni和/或Mn）的区域存在于 用WDX分析连接部分的横截面时的连接部分。 此外，连接结构被构造成使得当连接部分的横截面分别在垂直方向和横向方向上被均匀地分成十个部分以形成总共100个分段平方时，平方的比例 除了存在仅Sn基金属成分的正方形以外，所有正方形的数量存在两种以上具有不同构成元素的金属间化合物的比例为70％以上。

公开(公告)号：US20130233618A1

公开(公告)日：2013-09-12

申请号：US13868259

申请日：2013-04-23

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  B23K1/00 ,  B23K35/24

CPC classification number: H01R4/02 ,  B22F1/0014 ,  B22F1/0059 ,  B22F1/025 ,  B22F7/064 ,  B22F7/08 ,  B23K1/00 ,  B23K35/025 ,  B23K35/24 ,  B23K35/262 ,  B23K35/302 ,  C22C1/0483 ,  C22C1/0491 ,  C22C9/00 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/04

Abstract: A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

Abstract translation: 一种导电材料，其包含由第一金属和第二金属构成的金属成分，所述金属成分的熔点高于所述第一金属，所述第一金属为Sn或含有70重量％以上的Sn的合金， 第二金属是金属或合金，其与第一金属形成熔点为310℃以上的金属间化合物，并且其本身与在其周围产生的金属间化合物之间的晶格常数差为50％以上 第二金属。

公开(公告)号：US10010980B2

公开(公告)日：2018-07-03

申请号：US14697717

申请日：2015-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K35/02 ,  B23K1/00 ,  B23K35/26 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L23/00 ,  H05K3/34 ,  B23K35/36 ,  B23K35/362 ,  B23K101/40

CPC classification number: B23K35/025 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  B23K2101/40 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/11332 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83211 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  Y10T403/479 ,  Y10T428/31678 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00012

Abstract: A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.

公开(公告)号：US09368279B2

公开(公告)日：2016-06-14

申请号：US14450347

申请日：2014-08-04

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Hidekiyo Takaoka ,  Kosuke Nakano ,  Yutaka Ota ,  Kenichi Kawasaki

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G2/04 ,  H01G4/008 ,  H01G4/252

Abstract: An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

公开(公告)号：US09333593B2

公开(公告)日：2016-05-10

申请号：US14469842

申请日：2014-08-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: B23K1/19 ,  B23K1/00 ,  B23K31/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/22 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  B23K35/02 ,  H01G4/228 ,  B23K1/20

CPC classification number: B23K31/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3026 ,  B23K2101/00 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01G4/228 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T403/479

Abstract: A first joining object and a second joining object are joined to each other using an insert material. The first joining object and/or the second joining object has a first metal composed of Sn or an alloy containing Sn. The insert material contains, as a main component, a second metal which is an alloy containing at least one selected from among Ni, Mn, Al and Cr, and Cu, and is located between the first joining object and the second joining object. When subjected to heat treatment to produce an intermetallic compound of the first metal and the second metal, the first joining object and the second joining object are joined to each other.

Abstract translation: 使用插入材料将第一接合物体和第二接合物体彼此接合。 第一接合体和/或第二接合体具有由Sn或含有Sn的合金构成的第一金属。 插入材料含有作为主要成分的第二金属，其是含有选自Ni，Mn，Al和Cr中的至少一种的合金和Cu，并且位于第一接合物和第二接合物之间。 当进行热处理以产生第一金属和第二金属的金属间化合物时，第一接合物和第二接合物彼此接合。

公开(公告)号：US20160043480A1

公开(公告)日：2016-02-11

申请号：US14918648

申请日：2015-10-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  H01R4/58

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A joint structure that includes a first metal member, a second metal member, and a joint portion sandwiched between the first metal member and the second metal member. At least a Cu-M-Sn intermetallic compound is dispersed in the joint portion, M is at least one of Ni and Mn, and neither a Cu3Sn layer nor a Cu6Sn5 layer is present on at least one of interfaces between the joint portion and the first metal member and the second metal member.

Abstract translation: 一种接头结构，包括第一金属构件，第二金属构件和夹在第一金属构件和第二金属构件之间的接合部。 至少一种Cu-M-Sn金属间化合物分散在接头部分中，M是Ni和Mn中的至少一种，并且Cu 3 Sn层和Cu 6 Sn 5层不存在于接合部和 第一金属构件和第二金属构件。