Invention Application
US20160049253A1 MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR
审中-公开
多层电容器的多层电容器和安装结构
- Patent Title: MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR
- Patent Title (中): 多层电容器的多层电容器和安装结构
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Application No.: US14813204Application Date: 2015-07-30
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Publication No.: US20160049253A1Publication Date: 2016-02-18
- Inventor: Yohei MUKOBATA , Takashi SAWADA , Kazuhiro NISHIBAYASHI
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2014-164922 20140813
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/236 ; H01G4/01

Abstract:
In a multilayer capacitor, both a minimum distance in a thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface are shorter than any of a dimension in the thickness direction of a first extending portion of the first inner electrode, a dimension in the thickness direction of a second extending portion of the first inner electrode and a dimension in the thickness direction of the third extending portion of the second inner electrode.
Public/Granted literature
- US10170247B2 Multilayer capacitor and installation structure of multilayer capacitor Public/Granted day:2019-01-01
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