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公开(公告)号：US20240234029A9
公开(公告)日：2024-07-11
申请号：US18400401
申请日：2023-12-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
CPC classification number: H01G2/06 , H01G4/2325 , H01G4/30 , H01G4/008
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.
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公开(公告)号：US20220386467A1
公开(公告)日：2022-12-01
申请号：US17752906
申请日：2022-05-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
Abstract: A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.
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公开(公告)号：US20220384098A1
公开(公告)日：2022-12-01
申请号：US17752899
申请日：2022-05-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. One of the board main surfaces is in a vicinity of the electronic element and joined with a multilayer body main surface in a vicinity of the interposer board. The interposer board is an alumina board. At least one notch is in end regions including a board end surface, a board side surface in a vicinity thereof, a board main surface in a vicinity thereof, ridge portions between the board end surface and the board side surface, between the board end surface and the board main surface, and between the board side surface and the board main surface, and a corner portion between the board end surface, the board side surface, and the board main surface.
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公开(公告)号：US20220108839A1
公开(公告)日：2022-04-07
申请号：US17489855
申请日：2021-09-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.
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公开(公告)号：US20170178807A1
公开(公告)日：2017-06-22
申请号：US15450095
申请日：2017-03-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi SAWADA , Yohei MUKOBATA , Sui UNO
CPC classification number: H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325 , H01G4/30
Abstract: A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.
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Patent Agency Ranking
公开(公告)号：US20240312721A1
公开(公告)日：2024-09-19
申请号：US18670161
申请日：2024-05-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
CPC classification number: H01G4/30 , H01G2/06 , H01G4/2325 , H01G4/248
Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.
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公开(公告)号：US20220386466A1
公开(公告)日：2022-12-01
申请号：US17752896
申请日：2022-05-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.
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公开(公告)号：US20220384100A1
公开(公告)日：2022-12-01
申请号：US17752902
申请日：2022-05-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A solder layer is provided between the electronic element and the interposer board, joins the electronic element with the interposer board, and includes a solder unfilled region.
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公开(公告)号：US20180012705A1
公开(公告)日：2018-01-11
申请号：US15713785
申请日：2017-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sui UNO , Takashi SAWADA , Yohei MUKOBATA
Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.
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10.发明申请MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING A PAIR OF SIDE OUTER ELECTRODES AND A CENTER ELECTRODE 有权多层陶瓷电子元件，包括一对外部电极和一个中心电极公开(公告)号：US20160049242A1
公开(公告)日：2016-02-18
申请号：US14823184
申请日：2015-08-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi SAWADA , Yohei MUKOBATA , Sui UNO
CPC classification number: H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325 , H01G4/30
Abstract: A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film.
Abstract translation: 多层陶瓷电子部件包括具有第一至第六表面的多层陶瓷元件，位于多层陶瓷元件上的第一侧外电极和第二侧外电极之间的中心外电极。 在中心外电极上设置第一镀膜，第二镀膜分别设置在第一侧外电极和第二侧电极上，第二电镀膜的厚度大于 第一个镀膜。
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