Invention Application
- Patent Title: TRANSISTOR, INTEGRATED CIRCUIT AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 晶体管,集成电路及其制造方法
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Application No.: US14461061Application Date: 2014-08-15
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Publication No.: US20160049397A1Publication Date: 2016-02-18
- Inventor: Chia-Hao CHANG , Ming-Shan SHIEH , Cheng-Long CHEN , Wai-Yi LIEN , Chih-Hao WANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/45 ; H01L29/417 ; H01L29/423 ; H01L29/06 ; H01L21/3105 ; H01L21/285 ; H01L21/768 ; H01L29/786 ; H01L29/78 ; H01L21/8238

Abstract:
A transistor, an integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the transistor includes a source electrode, at least one semiconductor channel, a gate electrode, a drain electrode, and a drain pad. The source electrode is disposed in a substrate. The semiconductor channel extends substantially perpendicular to the source electrode. The gate electrode surrounds the semiconductor channel. The drain electrode is disposed on top of the semiconductor channel. The drain pad is disposed on the drain electrode, wherein the drain pad comprises multiple conductive layers.
Public/Granted literature
- US09985026B2 Transistor, integrated circuit and method of fabricating the same Public/Granted day:2018-05-29
Information query
IPC分类: