Invention Application
- Patent Title: FAN-OUT WAFER LEVEL PACKAGE
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Application No.: US14521893Application Date: 2014-10-23
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Publication No.: US20160064300A1Publication Date: 2016-03-03
- Inventor: Chu-Fu Lin , Chien-Li Kuo , Kuo-Ming Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Priority: CN201410430514.0 20140828
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/00 ; H01L23/522
Abstract:
A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.
Public/Granted literature
- US09269645B1 Fan-out wafer level package Public/Granted day:2016-02-23
Information query
IPC分类:
