公开(公告)号：US20160064300A1

公开(公告)日：2016-03-03

申请号：US14521893

申请日：2014-10-23

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chu-Fu Lin ,  Chien-Li Kuo ,  Kuo-Ming Chen

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L24/14 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2023/4037 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

Abstract: A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.

Abstract translation: 提供扇形晶圆级封装。 扇形晶片级封装包括半导体元件，模塑料，第一扇出结构，导热散热器和多个焊球。 半导体元件包括多个接合焊盘。 模塑料覆盖半导体元件。 第一扇出结构形成在半导体元件上，其中第一扇出结构具有电连接到接合焊盘的多个扇出接点。 导电散热器形成在第一扇出结构上，其中导电散热器具有填充有导电材料的多个通孔。 焊球形成在导电散热器上，其中焊球通过填充有导电材料的通孔与第一扇出结构电连接。

公开(公告)号：US09269645B1

公开(公告)日：2016-02-23

申请号：US14521893

申请日：2014-10-23

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chu-Fu Lin ,  Chien-Li Kuo ,  Kuo-Ming Chen

IPC: H01L23/40 ,  H01L23/34 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L24/14 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2023/4037 ,  H01L2023/4043 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043

Abstract: A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.

Abstract translation: 提供扇形晶圆级封装。 扇形晶片级封装包括半导体元件，模塑料，第一扇出结构，导热散热器和多个焊球。 半导体元件包括多个接合焊盘。 模塑料覆盖半导体元件。 第一扇出结构形成在半导体元件上，其中第一扇出结构具有电连接到接合焊盘的多个扇出接点。 导电散热器形成在第一扇出结构上，其中导电散热器具有填充有导电材料的多个通孔。 焊球形成在导电散热器上，其中焊球通过填充有导电材料的通孔与第一扇出结构电连接。