Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE HAVING ROUTING TRACES THEREIN
- Patent Title (中): 具有路由路径的半导体封装
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Application No.: US14794715Application Date: 2015-07-08
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Publication No.: US20160064310A1Publication Date: 2016-03-03
- Inventor: Saravuth Sirinorakul , Antonio Bambalan Dimaano, Jr. , Rui Huang
- Applicant: UTAC Headquarters Pte. Ltd.
- Assignee: UTAC Headquarters Pte. Ltd.
- Current Assignee: UTAC Headquarters Pte. Ltd.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/66 ; H01L21/48 ; H01L23/31

Abstract:
A method of and device for making a semiconductor package. The method comprises etching a first side of a metallic piece forming a leadframe with one or more wire bonding pads, applying a first protective layer on the first side, etching a second side of the metallic piece forming one or more conductive terminals, and applying a second protective layer on the second side. The semiconductor package comprises wire bonding pads in pillars structure surrounding a die attached to the leadframe. One or more terminals are on the bottom side of the semiconductor package.
Public/Granted literature
- US09564387B2 Semiconductor package having routing traces therein Public/Granted day:2017-02-07
Information query
IPC分类: