Invention Application
- Patent Title: CONTACT PRESSURE MEASURING APPARATUS, METHOD OF MANUFACTURING THE SAME AND METHOD OF MEASURING CONTACT PRESSURE
- Patent Title (中): 接触压力测量装置,其制造方法和测量接触压力的方法
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Application No.: US14820653Application Date: 2015-08-07
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Publication No.: US20160069756A1Publication Date: 2016-03-10
- Inventor: Sangkyu KIM , Joonhyung LEE , Seongho CHO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0119371 20140905
- Main IPC: G01L1/24
- IPC: G01L1/24 ; G01N21/31 ; G01M11/00

Abstract:
An apparatus and method for measuring a contact pressure and a method of manufacturing the apparatus. The apparatus includes: a material layer configured to provide a light path along which incident light travels to a subject being in contact with the material layer; a spectrum analyzer configured to detect light emitted from the material layer and perform a light absorption spectrum analysis on the detected light to determine an intensity of the detected light; and a pressure calculator configured to determine the contact pressure of the subject based on the determined intensity.
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