Invention Grant
- Patent Title: Contact pressure measuring apparatus, method of manufacturing the same and method of measuring contact pressure
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Application No.: US14820653Application Date: 2015-08-07
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Publication No.: US10088376B2Publication Date: 2018-10-02
- Inventor: Sangkyu Kim , Joonhyung Lee , Seongho Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0119371 20140905
- Main IPC: G01L1/24
- IPC: G01L1/24 ; G01N21/17 ; G01L9/00 ; G06F3/041 ; G06F3/042 ; G01L11/02 ; G01N23/046 ; G06F3/03 ; G01L1/25

Abstract:
An apparatus and method for measuring a contact pressure and a method of manufacturing the apparatus. The apparatus includes: a material layer configured to provide a light path along which incident light travels to a subject being in contact with the material layer; a spectrum analyzer configured to detect light emitted from the material layer and perform a light absorption spectrum analysis on the detected light to determine an intensity of the detected light; and a pressure calculator configured to determine the contact pressure of the subject based on the determined intensity.
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