Invention Application
- Patent Title: PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME
- Patent Title (中): 包装板，其制造方法和包装在其上的包装
-
Application No.: US14692101Application Date: 2015-04-21
-
Publication No.: US20160081182A1Publication Date: 2016-03-17
- Inventor: Myung Sam KANG , Young Gwan KO , Hye Jin KIM , Hye Won JUNG , Min Jae SEONG
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0123862 20140917
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/40 ; H05K3/46 ; H05K1/14 ; H05K1/11
Abstract:
There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
Public/Granted literature
- US09793250B2 Package board, method for manufacturing the same and package on package having the same Public/Granted day:2017-10-17
Information query
