公开(公告)号：US20160081182A1

公开(公告)日：2016-03-17

申请号：US14692101

申请日：2015-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myung Sam KANG ,  Young Gwan KO ,  Hye Jin KIM ,  Hye Won JUNG ,  Min Jae SEONG

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L25/105 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H05K3/4682 ,  H05K3/4697

Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.

Abstract translation: 提供了一种封装板，其制造方法和具有该封装板的封装。 根据本公开的示例性实施例的封装板包括形成有具有穿透形状的空腔的第一绝缘层; 以及形成为穿透所述第一绝缘层并形成在所述空腔的一侧的第一连接焊盘。

公开(公告)号：US20230199974A1

公开(公告)日：2023-06-22

申请号：US17698339

申请日：2022-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Hoon KO ,  Kee Su JEON ,  Ki Eun CHO ,  Min Jae SEONG

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K1/115 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/09563

Abstract: A printed circuit board including: a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer, and including a first wiring portion and a second wiring portion; and a second insulating layer disposed on the upper surface of the first insulating layer, having a cavity exposing an upper surface of the second wiring portion, and including a first insulating portion covering the first wiring portion and a second insulating portion whose upper surface is exposed from the cavity, wherein one or more gaps are provided between the second wiring portion and the second insulating portion.

公开(公告)号：US20150342046A1

公开(公告)日：2015-11-26

申请号：US14719309

申请日：2015-05-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin KIM ,  Hye Won JUNG ,  Myung Sam KANG ,  Kang Wook BONG ,  Young Gwan KO ,  Min Jae SEONG

IPC: H05K1/11 ,  C25D5/02 ,  H05K3/06 ,  H05K3/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/111 ,  C25D5/02 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K3/0091 ,  H05K3/064 ,  H05K3/284 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material.

Abstract translation: 连接到基板的一个表面的印刷电路板和第一电子部件安装在一个表面上。 印刷电路板包括至少一个绝缘层，并且绝缘层具有容纳形成在其中的第一电子部件的至少一部分的空腔，并且空腔具有由绝缘材料制成的内表面。

公开(公告)号：US20160095203A1

公开(公告)日：2016-03-31

申请号：US14870572

申请日：2015-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hong MIN ,  Myung Sam KANG ,  Young Gwan KO ,  Min Jae SEONG ,  Jin Hyuk JANG

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0207 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/467 ,  H01L23/49827 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/20 ,  H01L2224/2518 ,  H01L2924/15311 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/10416

Abstract: Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape.

Abstract translation: 这里公开了一种电路板，其包括由高导热材料形成的传热结构，其中除暴露于绝缘单元之外的空气冷却单元的传热结构的一部分插入绝缘单元中，并且空气冷却 单元具有具有高的非表面积的形状，例如起皱或不均匀的形状。

公开(公告)号：US20160095198A1

公开(公告)日：2016-03-31

申请号：US14870741

申请日：2015-09-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae Hong MIN ,  Myung Sam KANG ,  Young Gwan KO ,  Min Jae SEONG

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/023 ,  H05K1/141 ,  H05K1/185 ,  H05K3/4608 ,  H05K2201/041

Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.

Abstract translation: 这里公开了一种电路板。 根据本公开的示例性实施例，电路板具有其中将金属层和绝缘层交替堆叠的第一传热结构的至少一部分插入到绝缘部分中的结构。