In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.