APPARATUS AND METHOD FOR TREATING A SUBSTRATE
    1.
    发明申请
    APPARATUS AND METHOD FOR TREATING A SUBSTRATE 有权
    用于处理基板的装置和方法

    公开(公告)号:US20160089686A1

    公开(公告)日:2016-03-31

    申请号:US14862729

    申请日:2015-09-23

    CPC classification number: B05D1/002 H01L21/6708

    Abstract: In apparatus and method according to example embodiments of the inventive concept, a substrate may be treated using two or more treatment solutions. The substrate treating apparatus may include a treatment vessel providing a treatment space, a substrate supporting unit provided in the treatment vessel to support a substrate, and a solution supplying unit supplying a treatment solution on the substrate supported by the substrate supporting unit. The solution supplying unit may include an etching solution supplying nozzle supplying an etching solution on an edge region of the substrate supported by the substrate supporting unit and an etch prevention solution (EPS) supplying nozzle supplying an etch prevention solution on a center region of the substrate supported by the substrate supporting unit. Accordingly, it is possible to prevent the center region of the substrate from being dried.

    Abstract translation: 在根据本发明构思的示例性实施方案的设备和方法中,可以使用两种或更多种处理溶液来处理衬底。 基板处理装置可以包括提供处理空间的处理容器,设置在处理容器中以支撑基板的基板支撑单元,以及在由基板支撑单元支撑的基板上供给处理溶液的溶液供给单元。 溶液供给单元可以包括在由基板支撑单元支撑的基板的边缘区域上提供蚀刻溶液的蚀刻溶液供应喷嘴和在基板的中心区域上提供防腐蚀溶液的防蚀溶液(EPS)供应喷嘴 由基板支撑单元支撑。 因此,可以防止基板的中心区域被干燥。

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