Invention Application
US20160093547A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
有权
用于封装半导体器件的环氧树脂组合物和使用该半导体器件的半导体封装
- Patent Title: EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物和使用该半导体器件的半导体封装
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Application No.: US14706663Application Date: 2015-05-07
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Publication No.: US20160093547A1Publication Date: 2016-03-31
- Inventor: Sang Jin KIM , Eun Jung LEE , Yong Han CHO
- Applicant: SAMSUNG SDI CO., LTD.
- Priority: KR10-2014-0128685 20140925
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L23/00 ; C08L63/04
Abstract:
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:
Public/Granted literature
Information query
IPC分类:
