公开(公告)号：US20160368937A1

公开(公告)日：2016-12-22

申请号：US15189057

申请日：2016-06-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Dong Hwan LEE ,  Min Gyum KIM ,  So Yoon KIM ,  Woo Chul NA ,  Yoon Man LEE ,  Ji Yoon CHO ,  Ki Hyeok KWON ,  KyoungChul BAE ,  Eun Jung LEE ,  Joo Young CHUNG ,  Jin Min CHEON ,  Jin Woo CHOI ,  Seung HAN

IPC: C07F9/54 ,  H01L23/29 ,  C07C235/56 ,  C09D163/00 ,  C09D7/12

CPC classification number: C07F9/5442 ,  C07C235/64 ,  C08G59/621 ,  C08G59/688 ,  C09D163/00 ,  H01L23/295 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:

公开(公告)号：US20190292363A1

公开(公告)日：2019-09-26

申请号：US16301509

申请日：2017-02-15

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Yoon Man LEE ,  Jae Hyun KIM ,  Tae Shin EOM ,  Eun Jung LEE ,  Su Mi IM

IPC: C08L63/00 ,  C08K3/36 ,  H01L23/29

Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

公开(公告)号：US20160137808A1

公开(公告)日：2016-05-19

申请号：US14814271

申请日：2015-07-30

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Tae Shin EOM ,  Seung Yong YANG ,  Eun Jung LEE ,  Su Mi IM

IPC: C08K3/24

CPC classification number: C08K3/24 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein is an epoxy resin composition for encapsulating semiconductor devices, the epoxy resin composition including an epoxy resin, a curing agent, inorganic fillers, and a colorant, the colorant including a hydrate.

Abstract translation: 本发明公开了一种用于封装半导体器件的环氧树脂组合物，该环氧树脂组合物包括环氧树脂，固化剂，无机填料和着色剂，着色剂包括水合物。

公开(公告)号：US20160093547A1

公开(公告)日：2016-03-31

申请号：US14706663

申请日：2015-05-07

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sang Jin KIM ,  Eun Jung LEE ,  Yong Han CHO

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  C08L63/04

CPC classification number: H01L23/296 ,  C08G77/20 ,  C08K3/36 ,  C08L63/04 ,  C08L83/04 ,  C08L2205/05 ,  C09D163/04 ,  H01L23/295 ,  H01L24/32 ,  H01L33/56 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/186 ,  H01L2224/45099

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:

Abstract translation: 一种用于封装半导体器件和半导体封装的环氧树脂组合物，所述组合物包括环氧树脂; 由下式3表示的聚有机硅氧烷树脂; 固化剂; 固化促进剂; 和无机填料：