公开(公告)号：US20160093547A1

公开(公告)日：2016-03-31

申请号：US14706663

申请日：2015-05-07

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Sang Jin KIM ,  Eun Jung LEE ,  Yong Han CHO

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  C08L63/04

CPC classification number: H01L23/296 ,  C08G77/20 ,  C08K3/36 ,  C08L63/04 ,  C08L83/04 ,  C08L2205/05 ,  C09D163/04 ,  H01L23/295 ,  H01L24/32 ,  H01L33/56 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/186 ,  H01L2224/45099

Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:

Abstract translation: 一种用于封装半导体器件和半导体封装的环氧树脂组合物，所述组合物包括环氧树脂; 由下式3表示的聚有机硅氧烷树脂; 固化剂; 固化促进剂; 和无机填料：