Invention Application
US20160093567A1 SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE
审中-公开
系统，装置和基板中的互连方法
- Patent Title: SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE
- Patent Title (中): 系统，装置和基板中的互连方法
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Application No.: US14498397Application Date: 2014-09-26
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Publication No.: US20160093567A1Publication Date: 2016-03-31
- Inventor: Chin-Kwan KIM , Rajneesh KUMAR , Layal ROUHANA , Joan Rey V. BUOT , Omar James BCHIR
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768
Abstract:
A semiconductor substrate according to some examples of the disclosure may include a substrate with a cavity in a top surface of the substrate, a plurality of cavity interconnections embedded below a bottom surface of the cavity and extending to a bottom surface of the substrate, and a plurality of side interconnections to either side of the cavity extending from the top surface of the substrate to the bottom surface of the substrate. Each of the plurality of side interconnections may include an electrically conductive stop etch layer in the same horizontal plane as the bottom of the cavity.
Information query
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