Invention Application
US20160093591A1 MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION
有权
微电子系统（MEMS）债券发行结构和三维集成电路（3D IC）整合的转移方法
- Patent Title: MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND METHOD OF WAFER TRANSFER FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) INTEGRATION
- Patent Title (中): 微电子系统（MEMS）债券发行结构和三维集成电路（3D IC）整合的转移方法
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Application No.: US14498965Application Date: 2014-09-26
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Publication No.: US20160093591A1Publication Date: 2016-03-31
- Inventor: Je-Hsiung Jeffrey LAN , Wenyue ZHANG , Yang DU , Yong Ju LEE , Shiqun GU , Jing XIE
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L27/06 ; H01L21/762 ; H01L21/768 ; H01L21/683 ; H01L21/265 ; H01L23/528 ; H01L23/522 ; H01L25/00 ; H01L21/02
Abstract:
A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.
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