Invention Application
- Patent Title: Semiconductor Device and Method of Manufacturing the Same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14868857Application Date: 2015-09-29
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Publication No.: US20160093728A1Publication Date: 2016-03-31
- Inventor: Stefan Decker , Sven Lanzerstorfer , Thorsten Meyer , Robert Zink
- Applicant: Infineon Technologies AG
- Priority: DE102014114230.6 20140930
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L29/10 ; H01L29/66 ; H01L29/423

Abstract:
A semiconductor device comprises a semiconductor body. The semiconductor body comprises insulated gate field effect transistor cells. At least one of the insulated gate field effect transistor cells comprises a source zone of a first conductivity type, a body zone of a second, complementary conductivity type, a drift zone of the first conductivity type, and a trench gate structure extending into the semiconductor body through the body zone along a vertical direction. The trench gate structure comprises a gate electrode separated from the semiconductor body by a trench dielectric. The trench dielectric comprises a source dielectric part interposed between the gate electrode and the source zone and a gate dielectric part interposed between the gate electrode and the body zone. The ratio of a maximum thickness of the source dielectric part along a lateral direction and the minimum thickness of the gate dielectric part along the lateral direction is at least 1.5.
Public/Granted literature
- US09837530B2 Semiconductor device and method of manufacturing the same Public/Granted day:2017-12-05
Information query
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