Invention Application
- Patent Title: BONDING PROCESS
- Patent Title (中): 粘接工艺
-
Application No.: US14957598Application Date: 2015-12-03
-
Publication No.: US20160101596A1Publication Date: 2016-04-14
- Inventor: Ajay D. Padsalgikar
- Applicant: Aortech Inernational pIc
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/08 ; C09J175/04 ; B32B27/40 ; B32B7/10 ; B32B37/06 ; B32B27/28

Abstract:
The invention relates to a process for bonding a silicone or silicone based material to a polyurethane and use of the bonded silicone-polyurethane in the manufacture of biomaterials, devices, articles or implants, in particular long term implantable medical devices in the fields of cardiology, orthopaedics, plastic surgery and gastroenterology. The process involves the steps of (a) flame treating a surface of the silicone or silicone based material and (b) bonding the polyurethane to the flame treated surface of the silicone or silicone based material.
Public/Granted literature
- US09421737B2 Bonding process Public/Granted day:2016-08-23
Information query