Invention Application
- Patent Title: ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED METHODS
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Application No.: US14984082Application Date: 2015-12-30
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Publication No.: US20160111354A1Publication Date: 2016-04-21
- Inventor: JING-EN LUAN
- Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.
- Priority: CN201310629973.7 20131129; CN201320783051.7 20131129
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/367 ; H01L23/498 ; H01L23/31 ; H01L21/56 ; H01L23/00

Abstract:
An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.
Public/Granted literature
- US09466557B2 Electronic device with first and second contact pads and related methods Public/Granted day:2016-10-11
Information query
IPC分类: