公开(公告)号：US20160111354A1

公开(公告)日：2016-04-21

申请号：US14984082

申请日：2015-12-30

Applicant: STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

Inventor： JING-EN LUAN

IPC: H01L23/495 ,  H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.