Invention Application
- Patent Title: Heat Conversion Device
- Patent Title (中): 热转换装置
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Application No.: US14884295Application Date: 2015-10-15
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Publication No.: US20160111621A1Publication Date: 2016-04-21
- Inventor: Boone Won , Jong Bae Shin , Jong Min Lee , Yong Sang Cho
- Applicant: LG INNOTEK CO., LTD.
- Priority: KR10-2014-0139090 20141015
- Main IPC: H01L35/30
- IPC: H01L35/30 ; H01L35/32
Abstract:
Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.
Public/Granted literature
- US10153417B2 Heat conversion device Public/Granted day:2018-12-11
Information query
IPC分类:
