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    Vehicle lamp
    1.
    发明授权
    Vehicle lamp 有权

    公开(公告)号：US10344941B2

    公开(公告)日：2019-07-09

    申请号：US15751309

    申请日：2016-08-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Bae Shin ,  In Tae Kim ,  Boone Won

    IPC: B60Q1/00 ,  F21S45/33 ,  F21S43/00 ,  H01L35/30 ,  F21S45/43 ,  F21S45/60 ,  F21S41/30 ,  F21S41/20

    Abstract: An embodiment of the present invention relates to a vehicle lamp structure capable of removing condensation from a lens part, in which a heat source is supplied to a heat absorbing part of a thermoelectric module to increase a temperature of a cooling region, together with a temperature of a heat generation part (a heat generation region) of the thermoelectric module, thereby improving limited heat conversion efficiency of the thermoelectric module, and furthermore, a hot current of air and a high-temperature heat source are supplied to a lens part of a head lamp, thereby maximizing dehumidification efficiency in the lamp.

    Thermoelectric Module and Cooling Apparatus Comprising Same
    3.
    发明申请
    Thermoelectric Module and Cooling Apparatus Comprising Same 审中-公开
    包括其的热电模块和冷却装置

    公开(公告)号：US20160218266A1

    公开(公告)日：2016-07-28

    申请号：US14917162

    申请日：2014-09-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sang Gon Kim ,  Yong Sang Cho ,  Boone Won ,  Hyung Eui Lee

    IPC: H01L35/02 ,  H01L35/18 ,  F25B21/02 ,  H01L35/32

    Abstract: Embodiments of the present invention relate to a thermoelectric module used for cooling, and provide a thermoelectric module comprising: substrates facing each other; and a first semiconductor element and a second semiconductor element arranged between the substrates and electrically connected to each other, wherein the first semiconductor element and the second semiconductor element have mutually different volumes. The present invention has a structure allowing the cooling effect to be raised by having, in a unit cell comprising thermoelectric semiconductor elements, any one from among the semiconductor elements facing each other to have a volume greater than the other to enhance the rise in electrical conductivity.

    Abstract translation: 本发明的实施例涉及一种用于冷却的热电模块，并且提供一种热电模块，包括：彼此面对的基板; 以及布置在所述基板之间并彼此电连接的第一半导体元件和第二半导体元件，其中所述第一半导体元件和所述第二半导体元件具有相互不同的体积。 本发明具有通过在包含热电半导体元件的单电池中彼此面对的半导体元件中的任何一个具有大于另一个半导体元件的体积而增加导电性的升高的结构，从而提高冷却效果 。

    Thermoelectric Converter and Dehumidifier Using the Same
    5.
    发明申请
    Thermoelectric Converter and Dehumidifier Using the Same 审中-公开
    热电转换器及使用其的除湿机

    公开(公告)号：US20160290684A1

    公开(公告)日：2016-10-06

    申请号：US15086771

    申请日：2016-03-31

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Min Lee ,  Yong Sang Cho ,  Boone Won

    IPC: F25B21/04 ,  H01L35/18 ,  H01L35/16 ,  H01L35/32 ,  H01L35/02

    CPC classification number: F25B21/04 ,  F24F5/0042 ,  H01L35/02 ,  H01L35/16 ,  H01L35/18 ,  H01L35/30 ,  H01L35/32

    Abstract: A thermoelectric converter capable of improving cooling efficiency. The thermoelectric converter includes a first thermoelectric module including a first substrate, a second substrate disposed to face the first substrate, and a first thermoelectric element disposed between the first substrate and the second substrate; first and second thermoelectric conversion members disposed on the first and second substrates, respectively; a second thermoelectric module including a third substrate, a fourth substrate disposed to face the third substrate, and a second thermoelectric element disposed between the third substrate and the fourth substrate; third and fourth thermoelectric conversion members disposed on the third and fourth substrates, respectively; wherein the first and third substrates may be heat generation substrates, the second and fourth substrates may be heat absorption substrates, and the first and second thermoelectric modules may be arranged in a structure in which the second and fourth substrates face each other.

    Abstract translation: 一种能够提高冷却效率的热电转换器。 热电转换器包括：第一热电模块，包括第一基板，设置成面对第一基板的第二基板;以及设置在第一基板和第二基板之间的第一热电元件; 分别设置在第一和第二基板上的第一和第二热电转换部件; 第二热电模块，包括第三基板，设置成面对第三基板的第四基板和设置在第三基板和第四基板之间的第二热电元件; 分别设置在第三和第四基板上的第三和第四热电转换构件; 其中第一和第三基板可以是发热基板，第二和第四基板可以是吸热基板，并且第一和第二热电模块可以布置成第二和第四基板彼此面对的结构。

    Thermoelectric element
    7.
    发明授权
    Thermoelectric element 有权

    公开(公告)号：US12245508B2

    公开(公告)日：2025-03-04

    申请号：US18026868

    申请日：2021-09-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Tae Su Yang ,  Boone Won ,  Seung Hwan Lee

    IPC: H10N10/855 ,  H10N10/17 ,  H10N10/81 ,  H10N10/851

    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.

    Thermoelectric device
    8.
    发明授权
    Thermoelectric device 有权

    公开(公告)号：US11937505B2

    公开(公告)日：2024-03-19

    申请号：US17758261

    申请日：2020-12-24

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Boone Won

    IPC: H10N10/17 ,  H10N10/852

    CPC classification number: H10N10/17 ,  H10N10/852

    Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a lower metal substrate, a lower insulating layer disposed on the lower metal substrate, a plurality of lower electrodes disposed on the lower insulating layer to be spaced apart from each other, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of lower electrodes, a plurality of upper electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs to be spaced apart from each other, an upper insulating layer disposed on the plurality of upper electrodes, and an upper metal substrate disposed on the upper insulating layer, wherein the lower insulating layer includes a first insulating layer disposed on the lower metal substrate and a plurality of second insulating layers disposed on the first insulating layer to be spaced apart from each other.

    THERMOELECTRIC ELEMENT
    9.
    发明公开
    THERMOELECTRIC ELEMENT 审中-公开

    公开(公告)号：US20230337541A1

    公开(公告)日：2023-10-19

    申请号：US18026868

    申请日：2021-09-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Tae Su YANG ,  Boone Won ,  Seung LEE

    IPC: H10N10/855 ,  H10N10/851 ,  H10N10/17 ,  H10N10/81

    CPC classification number: H10N10/855 ,  H10N10/8556 ,  H10N10/17 ,  H10N10/81

    Abstract: A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.

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