中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.021 seconds)

    Thermoelectric element
    1.
    发明授权
    Thermoelectric element 有权

    公开(公告)号：US11980097B2

    公开(公告)日：2024-05-07

    申请号：US17088880

    申请日：2020-11-04

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Man Hue Choi ,  Sue Kyung Oh ,  Jong Min Lee

    IPC: H10N10/17

    CPC classification number: H10N10/17

    Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other, the second outer periphery and the third outer periphery are opposite to each other between the first outer periphery and the fourth outer periphery, the first electrode part includes a first region vertically overlapping the plurality of second electrodes, at least one of the plurality of first electrodes includes an extension portion extending toward the first outer periphery from the first region, the first through-hole is formed in an inside of the first region, and a shortest distance between the second outer periphery and a first electrode, which is closest to the second through-hole among the plurality of first electrodes, is within ±10% of a shortest distance between the second outer periphery and the extension portion.

    Heat conversion device
    3.
    发明授权
    Heat conversion device 有权

    公开(公告)号：US10153417B2

    公开(公告)日：2018-12-11

    申请号：US14884295

    申请日：2015-10-15

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Boone Won ,  Jong Bae Shin ,  Jong Min Lee ,  Yong Sang Cho

    IPC: H01L35/30 ,  H01L35/00 ,  F25B21/02 ,  H01L35/32 ,  F02G1/043

    Abstract: Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.

    Heat Conversion Device
    5.
    发明申请
    Heat Conversion Device 审中-公开
    热转换装置

    公开(公告)号：US20160111621A1

    公开(公告)日：2016-04-21

    申请号：US14884295

    申请日：2015-10-15

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Boone Won ,  Jong Bae Shin ,  Jong Min Lee ,  Yong Sang Cho

    IPC: H01L35/30 ,  H01L35/32

    CPC classification number: H01L35/30 ,  F02G1/043 ,  F25B21/02 ,  F25B2321/025 ,  H01L35/00 ,  H01L35/32

    Abstract: Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.

    Abstract translation: 本发明提供一种热转换装置，包括：壳体; 容纳在所述壳体中的热电模块，并且在彼此相对配置的衬底之间包括热电半导体; 分别设置在基板之间的第一温度转换部分和第二温度转换部分; 以及减热部，其用于引导在所述壳体中流动的流体的一部分并且通过所述第一温度转换部到所述第二温度转换部。

    HEAT CONVERSION DEVICE
    6.
    发明申请
    HEAT CONVERSION DEVICE 审中-公开
    热转换装置

    公开(公告)号：US20150333246A1

    公开(公告)日：2015-11-19

    申请号：US14710946

    申请日：2015-05-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jong Min Lee ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Joong Hyun Park ,  Hyung Min Sohn ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Yun Kyoung Jo

    IPC: H01L35/32 ,  H01L35/30

    CPC classification number: H01L35/30 ,  H01L35/32

    Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

    Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。

    Dehumidifier
    7.
    发明申请
    Dehumidifier 审中-公开

    公开(公告)号：US20180094823A1

    公开(公告)日：2018-04-05

    申请号：US15562708

    申请日：2016-03-30

    Applicant: LG Innotek Co., Ltd.

    Inventor： Jong Min Lee ,  Yong Sang Cho

    IPC: F24F3/153 ,  H01L35/30 ,  F25B21/02

    Abstract: Provided is a dehumidifier including: a dehumidification module including a compressor unit for compressing a refrigerant, a cooling unit for cooling air through the refrigerant, and a drying unit for drying air that passes through the cooling unit; and a thermoelectric module including a first substrate, a second substrate disposed to face the first substrate, a thermoelectric element disposed between the first substrate and the second substrate, a first heat conversion unit connected to the first substrate and disposed adjacent to the drying unit of the dehumidification module, and a second heat conversion unit connected to the second substrate and disposed adjacent to the cooling unit of the dehumidification module.

    Thermoelectric device
    8.
    发明授权
    Thermoelectric device 有权

    公开(公告)号：US12302758B2

    公开(公告)日：2025-05-13

    申请号：US18028016

    申请日：2021-07-20

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Man Hue Choi ,  Jong Min Lee ,  Se Woon Lee ,  Yong Sang Cho

    IPC: H10N10/17

    Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a first substrate; an insulating layer disposed on the first substrate; a first electrode unit disposed on the insulating layer; a first terminal electrode and a second terminal electrode disposed on the insulating layer and protruding from the first electrode unit toward the first outer side of the first substrate; a semiconductor structure disposed on the first electrode unit; a second electrode unit disposed on the semiconductor structure; and a second substrate unit disposed on the second electrode unit. The second substrate unit comprises a plurality of second substrates disposed away from one another. The first electrode unit comprises: a plurality of electrode groups respectively overlapping the plurality of second substrates vertically; and a first connection electrode connecting two different electrode groups among the plurality of electrode groups. The long side of the first connection electrode is longer than the long side of the first electrode included in the plurality of electrode groups. At least a part of the first connection electrode does not overlap the plurality of second substrates vertically.

    THERMOELECTRIC ELEMENT
    9.
    发明公开
    THERMOELECTRIC ELEMENT 审中-公开

    公开(公告)号：US20240251678A1

    公开(公告)日：2024-07-25

    申请号：US18624621

    申请日：2024-04-02

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Man Hue CHOI ,  Sue Kyung Oh ,  Jong Min Lee

    IPC: H10N10/17

    CPC classification number: H10N10/17

    Abstract: A thermoelectric element according to one embodiment of the present disclosure includes a first metal substrate including a first through-hole formed therein, a first insulating layer disposed on the first metal substrate and including a second through-hole formed at a position corresponding to the first through-hole, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a semiconductor structure disposed on the first electrode part, a second electrode part disposed on the semiconductor structure and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer, wherein the first metal substrate includes a first outer periphery, a second outer periphery, a third outer periphery, and a fourth outer periphery which define a shape of the first metal substrate, the first outer periphery and the fourth outer periphery are opposite to each other, the second outer periphery and the third outer periphery are opposite to each other between the first outer periphery and the fourth outer periphery, the first electrode part includes a first region vertically overlapping the plurality of second electrodes, at least one of the plurality of first electrodes includes an extension portion extending toward the first outer periphery from the first region, the first through-hole is formed in an inside of the first region, and a shortest distance between the second outer periphery and a first electrode, which is closest to the second through-hole among the plurality of first electrodes, is within ±10% of a shortest distance between the second outer periphery and the extension portion.

Patent Agency Ranking