Invention Application
- Patent Title: THERMAL INKJET PRINTHEAD STACK WITH AMORPHOUS METAL RESISTOR
- Patent Title (中): 热喷墨印刷电路板与非晶金属电阻器
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Application No.: US14787729Application Date: 2013-07-12
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Publication No.: US20160114584A1Publication Date: 2016-04-28
- Inventor: James Elmer ABBOT, JR. , Roberto A. PUGLIESE , Gerg Scott LONG
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2013/050205 WO 20130712
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.
Public/Granted literature
- US09469107B2 Thermal inkjet printhead stack with amorphous metal resistor Public/Granted day:2016-10-18
Information query
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