公开(公告)号：US20160114584A1

公开(公告)日：2016-04-28

申请号：US14787729

申请日：2013-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Elmer ABBOT, JR. ,  Roberto A. PUGLIESE ,  Gerg Scott LONG

IPC: B41J2/14

CPC classification number: B41J2/14129 ,  B41J2/14016 ,  B41J2/14088 ,  B41J2/14112 ,  B41J2/1601 ,  B41J2/164 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2202/03 ,  B41J2202/11 ,  H01C1/148 ,  H01C7/006 ,  H01C17/0652 ,  H01C17/06526 ,  H01L27/11582 ,  H01L28/00

Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.

Abstract translation: 本公开涉及具有非晶金属电阻器的热喷墨打印头堆叠，其包括绝缘基板和施加到绝缘基板的电阻器。 电阻器可以包括5原子％至90原子％的碳，硅或硼准金属; 和钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱或铂的第一和第二金属的5原子％至90原子％ 第二金属与第一金属不同。 准金属，第一金属和第二金属可以占非晶金属薄膜的至少70原子％。