发明申请
US20160115343A1 THERMOSETTING RESIN COMPOSITION, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET, AND POWER MODULE
审中-公开
热固性树脂组合物，制造导热片的方法和功率模块
- 专利标题： THERMOSETTING RESIN COMPOSITION, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET, AND POWER MODULE
- 专利标题（中）： 热固性树脂组合物，制造导热片的方法和功率模块
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申请号： US14896235申请日： 2014-01-10
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公开(公告)号： US20160115343A1公开(公告)日： 2016-04-28
- 发明人: Mariko TAKAHARA , Kenji MIMURA , Yurie NAKAMURA , Motoki MASAKI
- 申请人： MITSUBISHI ELECTRIC CORPORATION
- 申请人地址： JP Chiyoda-ku, Tokyo
- 专利权人： MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人： MITSUBISHI ELECTRIC CORPORATION
- 当前专利权人地址： JP Chiyoda-ku, Tokyo
- 优先权： JP2013-125480 20130614
- 国际申请： PCT/JP2014/050321 WO 20140110
- 主分类号： C09D163/00
- IPC分类号： C09D163/00 ; B29C41/02 ; H01L21/48 ; B29C41/00 ; C08K3/38 ; H01L23/373
摘要：
A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.
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