Invention Application
US20160116631A1 Method for Producing an Integrated Circuit Pointed Element, and Corresponding Integrated Circuit
审中-公开
用于制造集成电路指向元件的方法和相应的集成电路
- Patent Title: Method for Producing an Integrated Circuit Pointed Element, and Corresponding Integrated Circuit
- Patent Title (中): 用于制造集成电路指向元件的方法和相应的集成电路
-
Application No.: US14985037Application Date: 2015-12-30
-
Publication No.: US20160116631A1Publication Date: 2016-04-28
- Inventor: Abderrezak Marzaki , Yoann Goasduff , Virginie Bidal , Pascal Fornara
- Applicant: STMicroelectronics (Rousset) SAS
- Priority: FR1260912 20121116
- Main IPC: G01V7/04
- IPC: G01V7/04 ; B81C1/00 ; H01H37/32 ; H01L29/423 ; B81B3/00 ; H01H37/04 ; H01L21/3213 ; H01L49/02
Abstract:
A method for producing an integrated circuit pointed element is disclosed. An element has a projection with a concave part directing its concavity towards the element. The element includes a first etchable material. A zone is formed around the concave part of the element. The zone includes a second material that is less rapidly etchable than the first material for a particular etchant. The first material and the second material are etched with the particular etchant to form an open crater in the concave part and thus to form a pointed region of the element.
Public/Granted literature
Information query
