发明申请
- 专利标题: CIRCUIT STRUCTURE OF A FLIP-CHIP LIGHT EMITTING DIODE
- 专利标题(中): 片状发光二极管的电路结构
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申请号: US14733957申请日: 2015-06-08
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公开(公告)号: US20160118561A1公开(公告)日: 2016-04-28
- 发明人: Cheng-Wei Hung , Meng-Ting Tsai , Yu-Feng Lin
- 申请人: Genesis Photonics Inc.
- 优先权: TW103137181 20141028
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; H01L25/075 ; H01L33/60
摘要:
The invention relates to a circuit structure of a flip-chip light emitting diode. It is provided for assembling of the flip-chip light emitting diode. Each flip-chip light emitting diode has at least two electrodes. The circuit structure defines a light emitting surface on a surface of a substrate, and the light emitting surface is provided with a plurality of reflective and conductive surfaces. The reflective and conductive surface is used for assembling of the electrodes of the flip-chip light emitting diode. At least one flip-chip light emitting diode is connected in series, parallel or series-parallel on the light emitting surface, wherein the total area of the reflective and conductive surface accounts for 80% to 99% of the area of the light emitting surface. Accordingly, the circuit structure of the flip-chip light emitting diode can efficiently improve the luminous efficiency of flip-chip light emitting diode device by adding a proportion of the area of the reflective conduction surfaces on the substrate of the flip-chip light emitting diode.
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