Invention Application
- Patent Title: BONDING OF COMPOSITE MATERIALS
- Patent Title (中): 复合材料的结合
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Application No.: US14923972Application Date: 2015-10-27
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Publication No.: US20160121591A1Publication Date: 2016-05-05
- Inventor: Leonard MacAdams , Dalip Kohli
- Applicant: Cytec Industries Inc.
- Applicant Address: US NJ Woodland Park
- Assignee: Cytec Industries Inc.
- Current Assignee: Cytec Industries Inc.
- Current Assignee Address: US NJ Woodland Park
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B37/14 ; B05D3/00

Abstract:
A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
Public/Granted literature
- US09789646B2 Bonding of composite materials Public/Granted day:2017-10-17
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