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公开(公告)号：US10315404B2
公开(公告)日：2019-06-11
申请号：US15707160
申请日：2017-09-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/14 , B32B37/12 , B05D3/00 , B29C65/00 , C08J5/24 , C09J5/02 , C08J5/12 , C08G59/40 , B29C65/48 , B29C65/50
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US09789646B2
公开(公告)日：2017-10-17
申请号：US14923972
申请日：2015-10-27
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20180001572A1
公开(公告)日：2018-01-04
申请号：US15707160
申请日：2017-09-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C65/5057 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20150056433A1
公开(公告)日：2015-02-26
申请号：US14339905
申请日：2014-07-24
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
Abstract translation: 用于表面处理的剥离层和粘合剂之前的表面处理方法。 将富含树脂的剥离层施加到可固化的树脂基复合基材上，然后进行共固化。 共固化后，复合基材完全固化，但剥离层中的基体树脂保持部分固化。 当去除剥离层时，显示具有化学活性官能团的粗糙的可结合表面。 具有化学活性的可结合表面的复合衬底可以结合到另一复合衬底上以形成共价结合的结构。
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公开(公告)号：US12168729B2
公开(公告)日：2024-12-17
申请号：US17414132
申请日：2019-12-17
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip K. Kohli
IPC: C08L63/00 , B32B3/12 , C09D163/00 , C09K21/04
Abstract: A low-density, halogen-free epoxy composition that is flame-resistant upon curing and is suitable for use as a potting compound. The epoxy composition includes: (a) an epoxy component; (b) at least one curative; (c) at least one latent curing accelerator; (d) a toughening component that includes nano-sized core shell rubber (CSR) particles having particle size of less than 1 micron; (e) a fire-retardant component that is halogen-free; and (f) hollow microspheres for reducing the density of the composition. The fire-retardant component includes a mixture of: (i) at least one polyphosphate; (ii) at least one metal borate; and (iii) at least one compound selected from alkaline earth metal hydroxides and aluminum hydroxides.
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Patent Agency Ranking
公开(公告)号：US09636867B2
公开(公告)日：2017-05-02
申请号：US14339905
申请日：2014-07-24
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B29C65/00 , B32B7/06 , B32B7/12 , B32B27/38 , B32B37/00 , B32B37/12 , B32B38/10 , C08J5/24 , C09J5/02 , B29C65/48 , B29C65/50 , B29C65/02 , C09J163/00 , B32B5/02 , B32B5/12 , B32B38/00 , B29C70/54
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20160121591A1
公开(公告)日：2016-05-05
申请号：US14923972
申请日：2015-10-27
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
Abstract translation: 在粘合剂之前复合基材的表面处理方法。 将可固化的表面处理层施加到可固化的树脂基复合基材上，然后进行共固化。 共固化后，复合基材完全固化，但表面处理层保持部分固化。 表面处理层可以是由树脂浸渍织物构成的树脂膜或去除剥离层。 在表面制备之后，复合基板设置有化学活性的可结合的表面，其可以粘合地结合到另一复合基板上以形成共价结合的结构。
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公开(公告)号：US11664647B2
公开(公告)日：2023-05-30
申请号：US17381496
申请日：2021-07-21
Applicant: CYTEC INDUSTRIES INC.
Inventor： Junjie Jeffrey Sang , Fiorenzo Lenzi , Jonathan Edward Meegan , Leonard MacAdams , Yiqiang Zhao , Dalip Kumar Kohli
IPC: B32B27/26 , H02G13/00 , B32B15/14 , B64D45/02 , B32B3/14 , B32B27/08 , B32B5/02 , B32B5/26 , B32B27/18 , B32B15/08 , B32B3/26 , B32B27/28 , B32B27/38 , B32B15/092 , B32B15/20 , C08G59/18
CPC classification number: H02G13/80 , B32B3/14 , B32B3/266 , B32B5/022 , B32B5/024 , B32B5/26 , B32B15/08 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/283 , B32B27/38 , B64D45/02 , C08G59/18 , H02G13/00 , B32B2260/023 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2264/0207 , B32B2264/102 , B32B2264/105 , B32B2264/107 , B32B2264/108 , B32B2307/202 , B32B2307/212 , B32B2307/308 , B32B2307/3065 , B32B2307/4026 , B32B2307/536 , B32B2307/718 , B32B2307/732 , B32B2571/00 , B32B2605/18
Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.
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公开(公告)号：US10773508B2
公开(公告)日：2020-09-15
申请号：US15462817
申请日：2017-03-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/12 , C08J5/24 , C09J5/02 , B29C65/00 , B29C65/48 , B29C65/50 , B29C65/02 , C09J163/00 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/38 , B32B37/00 , B32B38/10 , B32B27/20 , C09J163/04 , B29C70/54 , B32B38/00 , B29L31/30
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20170190165A1
公开(公告)日：2017-07-06
申请号：US15462817
申请日：2017-03-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/12 , B29C65/02 , B29C65/50 , B29C65/00 , C09J163/00 , B32B7/12 , B32B27/20 , C08J5/24 , C09J5/02 , C09J163/04 , B29C65/48 , B32B37/00
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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