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公开(公告)号：US09636867B2
公开(公告)日：2017-05-02
申请号：US14339905
申请日：2014-07-24
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B29C65/00 , B32B7/06 , B32B7/12 , B32B27/38 , B32B37/00 , B32B37/12 , B32B38/10 , C08J5/24 , C09J5/02 , B29C65/48 , B29C65/50 , B29C65/02 , C09J163/00 , B32B5/02 , B32B5/12 , B32B38/00 , B29C70/54
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20160121591A1
公开(公告)日：2016-05-05
申请号：US14923972
申请日：2015-10-27
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
Abstract translation: 在粘合剂之前复合基材的表面处理方法。 将可固化的表面处理层施加到可固化的树脂基复合基材上，然后进行共固化。 共固化后，复合基材完全固化，但表面处理层保持部分固化。 表面处理层可以是由树脂浸渍织物构成的树脂膜或去除剥离层。 在表面制备之后，复合基板设置有化学活性的可结合的表面，其可以粘合地结合到另一复合基板上以形成共价结合的结构。
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公开(公告)号：US10773508B2
公开(公告)日：2020-09-15
申请号：US15462817
申请日：2017-03-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/12 , C08J5/24 , C09J5/02 , B29C65/00 , B29C65/48 , B29C65/50 , B29C65/02 , C09J163/00 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/38 , B32B37/00 , B32B38/10 , B32B27/20 , C09J163/04 , B29C70/54 , B32B38/00 , B29L31/30
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20170190165A1
公开(公告)日：2017-07-06
申请号：US15462817
申请日：2017-03-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/12 , B29C65/02 , B29C65/50 , B29C65/00 , C09J163/00 , B32B7/12 , B32B27/20 , C08J5/24 , C09J5/02 , C09J163/04 , B29C65/48 , B32B37/00
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US10315404B2
公开(公告)日：2019-06-11
申请号：US15707160
申请日：2017-09-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
IPC: B32B37/14 , B32B37/12 , B05D3/00 , B29C65/00 , C08J5/24 , C09J5/02 , C08J5/12 , C08G59/40 , B29C65/48 , B29C65/50
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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Patent Agency Ranking
6.发明授权公开(公告)号：US10240048B2
公开(公告)日：2019-03-26
申请号：US14132547
申请日：2013-12-18
Applicant: Cytec Industries Inc.
Inventor： Yiqiang Zhao , Dalip Kohli , Keltoum Ouzineb
IPC: C09D5/08 , C08K9/12 , C08F236/00 , C09D147/00 , C08K5/47 , C08K5/3475 , C07D277/82 , C07D403/12 , C07D249/18 , C07D235/28 , C08G59/08 , C08G59/56 , C08G59/20 , C08F220/18 , C08L33/06 , C23F11/00 , C09D163/00
Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.
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公开(公告)号：US09789646B2
公开(公告)日：2017-10-17
申请号：US14923972
申请日：2015-10-27
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20180001572A1
公开(公告)日：2018-01-04
申请号：US15707160
申请日：2017-09-18
Applicant: CYTEC INDUSTRIES INC.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B29C66/0224 , B05D3/007 , B29C65/4835 , B29C65/5042 , B29C65/5057 , B29C66/02245 , B29C66/1122 , B29C66/45 , B29C66/721 , B29C66/73753 , B32B37/12 , B32B37/14 , B32B2260/046 , B32B2305/72 , C08G59/40 , C08J5/124 , C08J5/24 , C08J2363/00 , C08J2463/00 , C09J5/02 , C09J2463/00 , C09J2463/006 , C09J2463/008
Abstract: A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.
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公开(公告)号：US20150056433A1
公开(公告)日：2015-02-26
申请号：US14339905
申请日：2014-07-24
Applicant: Cytec Industries Inc.
Inventor： Leonard MacAdams , Dalip Kohli
CPC classification number: B32B37/1207 , B29C65/02 , B29C65/4835 , B29C65/5057 , B29C66/0224 , B29C66/1122 , B29C66/30322 , B29C66/45 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/72143 , B29C66/73161 , B29C66/73751 , B29C66/7394 , B29C66/73941 , B29C70/54 , B29L2031/30 , B32B5/02 , B32B5/12 , B32B7/06 , B32B7/12 , B32B27/20 , B32B27/38 , B32B37/0038 , B32B37/025 , B32B37/12 , B32B38/10 , B32B2037/1253 , B32B2038/0076 , B32B2260/046 , B32B2262/02 , B32B2262/10 , B32B2305/188 , B32B2305/74 , B32B2315/085 , B32B2363/00 , B32B2605/18 , C08J5/24 , C08J2363/00 , C08J2363/04 , C08J2463/02 , C09J5/02 , C09J163/00 , C09J163/04 , C09J2463/003 , Y10T428/249921 , B29K2309/08 , B29K2307/04 , B29K2277/10 , B29K2223/06 , B29K2267/00 , B29K2063/00
Abstract: Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.
Abstract translation: 用于表面处理的剥离层和粘合剂之前的表面处理方法。 将富含树脂的剥离层施加到可固化的树脂基复合基材上，然后进行共固化。 共固化后，复合基材完全固化，但剥离层中的基体树脂保持部分固化。 当去除剥离层时，显示具有化学活性官能团的粗糙的可结合表面。 具有化学活性的可结合表面的复合衬底可以结合到另一复合衬底上以形成共价结合的结构。
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10.发明申请CORROSION-INHIBITING MICROGELS AND NON-CHROMATED PRIMER COMPOSITIONS INCORPORATING THE SAME 审中-公开腐蚀抑制微晶和非色素化合物组合物公开(公告)号：US20140187672A1
公开(公告)日：2014-07-03
申请号：US14132547
申请日：2013-12-18
Applicant: Cytec Industries Inc.
Inventor： Yiqiang Zhao , Dalip Kohli , Keltoum Ouzineb
IPC: C09D5/08
CPC classification number: C09D5/086 , C07D235/28 , C07D249/18 , C07D277/82 , C07D403/12 , C08F236/00 , C08G59/08 , C08G59/56 , C08K5/3475 , C08K5/47 , C08K9/12 , C09D5/08 , C09D5/082 , C09D147/00 , C09D163/00 , C08L33/06
Abstract: Corrosion-inhibiting microgels that are suitable for use in non-chromated primer compositions. Each discrete microgel is composed of a cross-linked polymer network and organic corrosion-inhibiting compounds entrapped or immobilized within the polymer network.
Abstract translation: 适用于非镀铬底漆组合物的防腐蚀微凝胶。 每个离散的微凝胶由交联聚合物网络和被包埋或固定在聚合物网络内的有机腐蚀抑制化合物组成。
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