Invention Application
- Patent Title: COPPER ALLOY WIRE
- Patent Title (中): 铜合金线
-
Application No.: US14890116Application Date: 2014-05-22
-
Publication No.: US20160122849A1Publication Date: 2016-05-05
- Inventor: Yasuhiro TSUGAWA , Toshio SAKAMOTO
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-110079 20130524; JP2014-068368 20140328
- International Application: PCT/JP2014/063564 WO 20140522
- Main IPC: C22C9/06
- IPC: C22C9/06 ; B22D21/00 ; B22D11/00 ; C22C9/02 ; C22F1/08

Abstract:
This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.
Public/Granted literature
- US10584400B2 Copper alloy wire Public/Granted day:2020-03-10
Information query