公开(公告)号：US20160122849A1

公开(公告)日：2016-05-05

申请号：US14890116

申请日：2014-05-22

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yasuhiro TSUGAWA ,  Toshio SAKAMOTO

IPC: C22C9/06 ,  B22D21/00 ,  B22D11/00 ,  C22C9/02 ,  C22F1/08

Abstract: This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.

Abstract translation: 该铜合金线是由含有Co，P，Sn的析出硬化型铜合金构成的铜合金线，使用连续铸造法或使用连续铸造的连续铸造线材的冷加工制造 其中铜合金线具有包括Co：0.20质量％以上且0.35质量％以下的成分，P：大于0.095质量％以上且0.15质量％以下的成分， 和Sn：大于等于0.01质量％且小于等于0.5质量％，余量为Cu和不可避免的杂质。

公开(公告)号：US20240183009A1

公开(公告)日：2024-06-06

申请号：US18547597

申请日：2022-02-08

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yosuke NAKASATO ,  Kazunari MAKI ,  Yasuhiro TSUGAWA ,  U TANI

IPC: C22C9/01 ,  C23C14/34

CPC classification number: C22C9/01 ,  C23C14/3414 ,  C22F1/08

Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, and Al: 0.4 mass % or more and 5.7 mass % or less, with a remainder being Cu and inevitable impurities, among the inevitable impurities, an amount of Fe is 0.0020 mass % or less, an amount of O is 0.0020 mass % or less, an amount of S is 0.0030 mass % or less, and an amount of P is 0.0010 mass % or less, a special grain boundary length ratio (Lσ/L) which is a ratio of a sum Lσ of lengths of grain boundaries with 3≤Σ≤29 to a length L of all measured crystal grain boundaries by an EBSD method is 20% or more, and an average crystal grain size μA in a sheet-thickness central portion is 40 μm or less.

公开(公告)号：US20240124955A1

公开(公告)日：2024-04-18

申请号：US18547409

申请日：2022-02-08

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yosuke NAKASATO ,  Kazunari MAKI ,  Yasuhiro TSUGAWA ,  U TANI

IPC: C22C9/01 ,  B22D11/00 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/34 ,  H01J37/34

CPC classification number: C22C9/01 ,  B22D11/004 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/3414 ,  H01J37/3426 ,  H01J2237/332

Abstract: This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.