Invention Application
- Patent Title: THERMAL MITIGATION BASED ON PREDICATED TEMPERATURES
- Patent Title (中): 基于预测温度的热减压
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Application No.: US14532980Application Date: 2014-11-04
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Publication No.: US20160124475A1Publication Date: 2016-05-05
- Inventor: Rajit CHANDRA
- Applicant: QUALCOMM Incorporated
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G05B13/04

Abstract:
An apparatus is presented. The apparatus includes a first circuit configured to predict temperatures of a location for a plurality of time instances based on measured temperatures and a second circuit configured to schedule a thermal mitigation function based on the predicted temperatures. A method of operating an apparatus is presented. The method includes measuring temperatures on an integrated circuit, predicting temperatures of a location for a plurality of time instances based on the measured temperatures, and scheduling a thermal mitigation function based on the predicted temperatures. An apparatus is presented. The apparatus includes means for measuring temperatures on an integrated circuit, means for predicting temperatures of a location for a plurality of time instances based on measured temperatures, and means for scheduling a thermal mitigation function based on the predicted temperatures.
Public/Granted literature
- US10416737B2 Thermal mitigation based on predicted temperatures Public/Granted day:2019-09-17
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