Invention Application
US20160124475A1 THERMAL MITIGATION BASED ON PREDICATED TEMPERATURES 审中-公开
基于预测温度的热减压

  • Patent Title: THERMAL MITIGATION BASED ON PREDICATED TEMPERATURES
  • Patent Title (中): 基于预测温度的热减压
  • Application No.: US14532980
    Application Date: 2014-11-04
  • Publication No.: US20160124475A1
    Publication Date: 2016-05-05
  • Inventor: Rajit CHANDRA
  • Applicant: QUALCOMM Incorporated
  • Main IPC: G06F1/20
  • IPC: G06F1/20 G05B13/04
THERMAL MITIGATION BASED ON PREDICATED TEMPERATURES
Abstract:
An apparatus is presented. The apparatus includes a first circuit configured to predict temperatures of a location for a plurality of time instances based on measured temperatures and a second circuit configured to schedule a thermal mitigation function based on the predicted temperatures. A method of operating an apparatus is presented. The method includes measuring temperatures on an integrated circuit, predicting temperatures of a location for a plurality of time instances based on the measured temperatures, and scheduling a thermal mitigation function based on the predicted temperatures. An apparatus is presented. The apparatus includes means for measuring temperatures on an integrated circuit, means for predicting temperatures of a location for a plurality of time instances based on measured temperatures, and means for scheduling a thermal mitigation function based on the predicted temperatures.
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