Invention Application
- Patent Title: THERMAL MITIGATION OF MULTI-CORE PROCESSOR
- Patent Title (中): 多核处理器的热减缓
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Application No.: US14675409Application Date: 2015-03-31
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Publication No.: US20160124476A1Publication Date: 2016-05-05
- Inventor: Rajat MITTAL , Madan KRISHNAPPA , Rajit CHANDRA , Mohammad TAMJIDI
- Applicant: QUALCOMM Incorporated
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F9/48 ; G06F1/32 ; G06F9/50

Abstract:
A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.
Public/Granted literature
- US09582052B2 Thermal mitigation of multi-core processor Public/Granted day:2017-02-28
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