Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体结构及其制造方法
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Application No.: US14537913Application Date: 2014-11-11
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Publication No.: US20160133559A1Publication Date: 2016-05-12
- Inventor: Jui-Fa Lu , Chin-Chun Huang , Chun-Nien Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L29/423 ; H01L21/768 ; H01L21/22 ; H01L49/02 ; H01L27/06
Abstract:
A semiconductor structure includes a substrate comprising a plurality of layers formed thereon, at least a first device formed in one of the layers formed thereon, a drawn region enclosing the first device, and a plurality of dummy structures in another layer. The dummy structures are formed in a first region correspondingly outside of the drawing region and in a second region correspondingly inside of the drawing region.
Information query
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