发明申请
- 专利标题： A CIRCUIT BOARD COMPRISING AN INSULATING DIAMOND MATERIAL
- 专利标题（中）： 包含绝缘金刚石材料的电路板
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申请号： US14901008申请日： 2014-06-25
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公开(公告)号： US20160157342A1公开(公告)日： 2016-06-02
- 发明人: Samantha Lichter , Nicholas Apollo , David Garrett , Kumaravelu Ganesan , Hamish Meffin , Steven Prawer
- 申请人： THE UNIVERSITY OF MELBOURNE , NATIONAL ICT AUSTRALIA LIMITED
- 优先权： AU2013902332 20130625
- 国际申请： PCT/AU2014/000660 WO 20140625
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K3/10 ; A61N1/36 ; H05K3/14 ; H05K1/11 ; H05K1/09 ; H05K3/00
摘要：
A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
公开/授权文献
- US09867286B2 Circuit board comprising an insulating diamond material 公开/授权日：2018-01-09
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