A package structure for a light emitting device is provided, wherein an anisotropic conductive film (ACF) and flip-chip bonding technique can be applied for bonding the light emitting device to a carrier. In addition, plural package units are stacked by performing a build-up process or a lamination process to form a full color micro-display. The package structure for the light emitting device provides simple and quick manufacturing process and is suitable for mass production. Furthermore, solutions for optical issues such as light guiding or light mixing are also provided.