Invention Application
- Patent Title: INTEGRATED MILLIMETER-WAVE CHIP PACKAGE
- Patent Title (中): 集成的毫米波芯片包装
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Application No.: US14569791Application Date: 2014-12-15
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Publication No.: US20160172317A1Publication Date: 2016-06-16
- Inventor: Cheng-Hua Tsai , Shyh-Jong Chung , Ching-Kuan Lee
- Applicant: Industrial Technology Research Institute
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/00 ; H01L23/538
Abstract:
An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer structure includes at least an antenna pattern and at least a plated through-hole structure penetrating through the interposer structure and connected to the at least one antenna pattern. The millimeter-wave chip is electrically connected to the at least antenna pattern located either above or below the millimeter-wave chip through the at least plated through-hole structure.
Public/Granted literature
- US09941226B2 Integrated millimeter-wave chip package Public/Granted day:2018-04-10
Information query
IPC分类:
