发明申请
- 专利标题： BONDING MATERIAL AND BONDING METHOD USING THE SAME
- 专利标题（中）： 使用相同的材料和粘合方法
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申请号： US14966585申请日： 2015-12-11
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公开(公告)号： US20160172328A1公开(公告)日： 2016-06-16
- 发明人: Keiichi ENDOH , Yutaka HISAEDA , Akihiro MIYAZAWA , Aiko NAGAHARA , Toshihiko UEYAMA
- 申请人： DOWA Electronics Materials Co., Ltd.
- 申请人地址： JP Tokyo
- 专利权人： DOWA Electronics Materials Co., Ltd.
- 当前专利权人： DOWA Electronics Materials Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-058370 20100315
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K35/30 ; B23K1/00
摘要：
A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
公开/授权文献
- US10090275B2 Bonding method using bonding material 公开/授权日：2018-10-02
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