公开(公告)号：US20160101486A1

公开(公告)日：2016-04-14

申请号：US14787163

申请日：2014-04-25

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Keiichi ENDOH ,  Hiromasa MIYOSHI ,  Takashi HINOTSU ,  Satoru KURITA ,  Yoshiko KOHNO

IPC分类号： B23K35/02 ,  B23K35/30 ,  B23K1/00

CPC分类号： B23K35/025 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B23K1/00 ,  B23K35/3006

摘要： There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.

摘要翻译： 提供了可以在较低温度（例如200℃或更低）下结合的金属纳米颗粒分散体，并且能够获得粘合部分，金属纳米颗粒分散体的优异的机械性能和电性能，包括：金属 纳米颗粒，其中每个颗粒的表面的至少一部分涂覆有具有8个或更多个碳原子的胺A; 以及用于分散金属纳米颗粒的分散介质，其中分散介质含有胺B，其为具有7个或更少碳原子的伯，仲或叔胺，并且是直链烷基胺或链烷醇胺。

公开(公告)号：US20200094318A1

公开(公告)日：2020-03-26

申请号：US16473072

申请日：2017-12-28

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Hideyuki FUJIMOTO ,  Keiichi ENDOH ,  Tatsuro HORI ,  Satoru KURITA

IPC分类号： B22F1/00 ,  B22F7/06

摘要： The present invention aims at providing a bonding material having both preferable dispensing properties and preferable bonding properties, and also providing a bonding method employing the bonding material. Provided are: a bonding material comprising fine silver particles having an average primary particle diameter of smaller than or equal to 130 nm, and a crosslinking-type inter-particle distance keeping agent crosslinking between the fine silver particles and keeping a distance between the fine silver particles; and a bonding method employing the bonding material.

公开(公告)号：US20230311249A1

公开(公告)日：2023-10-05

申请号：US18024840

申请日：2020-09-30

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Keiichi ENDOH ,  Toshihiko UEYAMA

IPC分类号： B23K35/30 ,  B23K35/02

CPC分类号： B23K35/3006 ,  B23K35/025 ,  B23K2103/56

摘要： There is provided a bonding paste capable of forming a uniform bonding layer by reducing occurrence of voids at edges even when a bonding area is large, and bonding method using the paste, and provides a metal paste for bonding containing at least metal nanoparticles (A) having a number average primary particle size of 10 to 100 nm, wherein a cumulative weight loss value (L100) when a temperature is raised from 40° C. to 100° C. is 75 or less, and a cumulative weight loss value (L150) when a temperature is raised from 40° C. to 150° C. is 90 or more, and a cumulative weight loss value (L200) when a temperature is raised from 40° C. to 200° C. is 98 or more, based on 100 cumulative weight loss value (L700) when the paste is heated from 40° C. to 700° C. at a heating rate of 3° C./min in a nitrogen atmosphere.

公开(公告)号：US20180331063A1

公开(公告)日：2018-11-15

申请号：US16042123

申请日：2018-07-23

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Satoru KURITA ,  Keiichi ENDOH ,  Hiromasa MIYOSHI

IPC分类号： H01L23/00 ,  B22F1/00 ,  B22F5/00 ,  B23K35/30 ,  B23K103/00 ,  B23K103/12

CPC分类号： H01L24/27 ,  B22F1/0018 ,  B22F1/0074 ,  B22F5/006 ,  B22F2999/00 ,  B23K35/3006 ,  B23K2103/12 ,  B23K2103/56 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/277 ,  H01L2224/29017 ,  H01L2224/29339 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/10253 ,  H01L2924/15788 ,  B22F3/22

摘要： A method for joining an electronic part, comprising: inserting a joining silver sheet between an electronic part and a substrate, to which the electronic part is to be joined; and heating them to the temperature range of TA (° C.) or higher and TB (° C.) or lower, under application of a pressure to the electronic part and the substrate to make a contact surface pressure of the electronic part and the silver sheet of from 0.5 to 3 MPa. The joining silver sheet comprises silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of “TA (° C.) or higher and TB (° C.) or lower satisfying the following expression (1): 270≤TA

公开(公告)号：US20160254243A1

公开(公告)日：2016-09-01

申请号：US15028453

申请日：2014-10-06

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： Satoru KURITA ,  Keiichi ENDOH ,  Hiromasa MIYOSHI

IPC分类号： H01L23/00 ,  B23K35/30 ,  B22F5/00

CPC分类号： H01L24/27 ,  B22F1/0018 ,  B22F1/0074 ,  B22F5/006 ,  B22F2999/00 ,  B23K35/3006 ,  B23K2103/12 ,  B23K2103/56 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/277 ,  H01L2224/29017 ,  H01L2224/29339 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/10253 ,  H01L2924/15788 ,  B22F3/22

摘要： A joining silver sheet with high joining strength contains silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from TA to TB (° C.) satisfying 270 £ TA

摘要翻译： 具有高接合强度的接合银片包含通过烧结而整合的粒径为1至250nm的银颗粒，并且具有在加热时进一步进行烧结并将银片保持在TA至TB的温度范围内的能力（ ℃），满足270£TA

公开(公告)号：US20160172328A1

公开(公告)日：2016-06-16

申请号：US14966585

申请日：2015-12-11

申请人： DOWA Electronics Materials Co., Ltd.

发明人： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC分类号： H01L23/00 ,  B23K35/30 ,  B23K1/00

CPC分类号： H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

摘要： A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.

摘要翻译： 接合两种不同物质的方法包括以下步骤：将包含含有至少两个羧基的有机材料的助熔剂成分的接合材料施加到接合物的接合表面，将待接合物体设置在接合材料上 在设置待接合物体的状态下，在预设温度下进行预烧，并且在比预热的温度高的温度下进行加热。

公开(公告)号：US20160099087A1

公开(公告)日：2016-04-07

申请号：US14966598

申请日：2015-12-11

申请人： DOWA Electronics Materials Co., Ltd.

发明人： Keiichi ENDOH ,  Yutaka HISAEDA ,  Akihiro MIYAZAWA ,  Aiko NAGAHARA ,  Toshihiko UEYAMA

IPC分类号： H01B1/02 ,  B23K35/30 ,  B23K35/02 ,  H01L23/00 ,  B23K1/00

CPC分类号： H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

摘要： A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.

摘要翻译： 通过涂布含有平均一次粒径为1〜200nm的银纳米粒子的银膏，进行烧成，得到粘合体。 在惰性气氛中在250℃加热10分钟时，Ag的（111）面上的结合产物的微晶直径为65nm以上。