Invention Application
US20160187897A1 THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR ELECTRONIC DEVICE 审中-公开
电子设备的热控制系统和热控制方法

  • Patent Title: THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR ELECTRONIC DEVICE
  • Patent Title (中): 电子设备的热控制系统和热控制方法
  • Application No.: US14583817
    Application Date: 2014-12-29
  • Publication No.: US20160187897A1
    Publication Date: 2016-06-30
  • Inventor: Mark Shane PengLee-Kee Yong
  • Applicant: MEDIATEK INC.
  • Main IPC: G05D23/19
  • IPC: G05D23/19 G05B15/02
THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR ELECTRONIC DEVICE
Abstract:
The present invention provides a thermal control system and a thermal control method for an electronic device. The thermal control system comprises: an integrated circuit, a determining unit, an adding unit, and a proportional-integral-derivative (PID) controlling unit. The determining unit is utilized for determining at least a target thermal parameter for the integrated circuit. The adding unit is coupled to the integrated circuit and the determining unit, and utilized for receiving the target thermal parameter and at least an actual thermal parameter of the integrated circuit to generate at least an error thermal parameter accordingly. The PID controlling unit is coupled to the adding unit and the integrated circuit, and utilized for generating at least a performance level for the integrated circuit according to the error thermal parameter.
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