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    Adaptive optimization of low power strategies
    2.
    发明授权
    Adaptive optimization of low power strategies 有权

    公开(公告)号：US10345887B2

    公开(公告)日：2019-07-09

    申请号：US15148031

    申请日：2016-05-06

    Applicant: MEDIATEK INC.

    Inventor： Kuo-SU Hsiao ,  Yen-Lin Lee ,  Shih-Yen Chiu ,  Jia-Ming Chen ,  Mark Shane Peng ,  Ya-Ting Chang

    IPC: G06F1/32 ,  G06F1/3287 ,  G06F1/324 ,  G06F1/329 ,  G06F1/3296 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3228 ,  G06F1/3234 ,  G06F1/3293

    Abstract: Methods and apparatus are provided for adaptive optimization of low-power strategies. In one novel aspect, the device monitors one or more thermal-performance parameters and determines a plurality of operation scenarios for a plurality of corresponding low-power policies. Based on corresponding operation scenarios, the device selects corresponding low-power policy. The device applies different low-power strategy for temperature control based on low-power policies. Different low-power policy is applied to different low-power techniques, such as the DVFS, the CPU hot-plug, and the task migration. In another novel aspect, the device obtains one or more user-defined policy for each corresponding low-power technique. The selection of each low-power policy is further based on its corresponding user-defined policy. In one embodiment, the user-defined DVFS policy includes power policy, performance policy, and DVFS-balanced policy. The user-defined CPU hot-plug policy includes conservative policy, aggressive policy, and hot-plug-balanced policy. The user-defined task-migration policy includes performance policy, and task-migration-balanced policy.

    Thermal control system and thermal control method for electronic device
    3.
    发明授权
    Thermal control system and thermal control method for electronic device 有权

    公开(公告)号：US10114432B2

    公开(公告)日：2018-10-30

    申请号：US14583817

    申请日：2014-12-29

    Applicant: MEDIATEK INC.

    Inventor： Mark Shane Peng ,  Lee-Kee Yong

    IPC: G05D23/19 ,  G06F1/20

    Abstract: The present invention provides a thermal control system and a thermal control method for an electronic device. The thermal control system comprises: an integrated circuit, a determining unit, an adding unit, and a proportional-integral-derivative (PID) controlling unit. The determining unit is utilized for determining at least a target thermal parameter for the integrated circuit. The adding unit is coupled to the integrated circuit and the determining unit, and utilized for receiving the target thermal parameter and at least an actual thermal parameter of the integrated circuit to generate at least an error thermal parameter accordingly. The PID controlling unit is coupled to the adding unit and the integrated circuit, and utilized for generating at least a performance level for the integrated circuit according to the error thermal parameter.

    Adaptive Optimization of Low Power Strategies
    4.
    发明申请
    Adaptive Optimization of Low Power Strategies 审中-公开

    公开(公告)号：US20170322616A1

    公开(公告)日：2017-11-09

    申请号：US15148031

    申请日：2016-05-06

    Applicant: MEDIATEK INC.

    Inventor： Kuo-Su Hsiao ,  Yen-Lin Lee ,  Shih-Yen Chiu ,  Jia-Ming Chen ,  Mark Shane Peng ,  Ya-Ting Chang

    IPC: G06F1/32

    CPC classification number: G06F1/3287 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/3228 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/329 ,  G06F1/3293 ,  G06F1/3296 ,  Y02D10/122 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16 ,  Y02D10/171 ,  Y02D10/172 ,  Y02D10/24

    Abstract: Methods and apparatus are provided for adaptive optimization of low-power strategies. In one novel aspect, the device monitors one or more thermal-performance parameters and determines a plurality of operation scenarios for a plurality of corresponding low-power policies. Based on corresponding operation scenarios, the device selects corresponding low-power policy. The device applies different low-power strategy for temperature control based on low-power policies. Different low-power policy is applied to different low-power techniques, such as the DVFS, the CPU hot-plug, and the task migration. In another novel aspect, the device obtains one or more user-defined policy for each corresponding low-power technique. The selection of each low-power policy is further based on its corresponding user-defined policy. In one embodiment, the user-defined DVFS policy includes power policy, performance policy, and DVFS-balanced policy. The user-defined CPU hot-plug policy includes conservative policy, aggressive policy, and hot-plug-balanced policy. The user-defined task-migration policy includes performance policy, and task-migration-balanced policy.

    THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR ELECTRONIC DEVICE
    6.
    发明申请
    THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR ELECTRONIC DEVICE 审中-公开
    电子设备的热控制系统和热控制方法

    公开(公告)号：US20160187897A1

    公开(公告)日：2016-06-30

    申请号：US14583817

    申请日：2014-12-29

    Applicant: MEDIATEK INC.

    Inventor： Mark Shane Peng ,  Lee-Kee Yong

    IPC: G05D23/19 ,  G05B15/02

    CPC classification number: G06F1/206 ,  G05D23/1919

    Abstract: The present invention provides a thermal control system and a thermal control method for an electronic device. The thermal control system comprises: an integrated circuit, a determining unit, an adding unit, and a proportional-integral-derivative (PID) controlling unit. The determining unit is utilized for determining at least a target thermal parameter for the integrated circuit. The adding unit is coupled to the integrated circuit and the determining unit, and utilized for receiving the target thermal parameter and at least an actual thermal parameter of the integrated circuit to generate at least an error thermal parameter accordingly. The PID controlling unit is coupled to the adding unit and the integrated circuit, and utilized for generating at least a performance level for the integrated circuit according to the error thermal parameter.

    Abstract translation: 本发明提供一种用于电子设备的热控制系统和热控制方法。 热控制系统包括：集成电路，确定单元，加法单元和比例积分微分（PID）控制单元。 确定单元用于确定集成电路的至少一个目标热参数。 加法单元耦合到集成电路和确定单元，并用于接收目标热参数和至少集成电路的实际热参数，从而相应地产生至少一个误差热参数。 PID控制单元耦合到加法单元和集成电路，并用于根据误差热参数为集成电路产生至少一个性能水平。

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