Invention Application
US20160192496A1 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME
有权
具有用于焊接连接的多孔网络的接触结构及其制造方法
- Patent Title: CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME
- Patent Title (中): 具有用于焊接连接的多孔网络的接触结构及其制造方法
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Application No.: US14942781Application Date: 2015-11-16
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Publication No.: US20160192496A1Publication Date: 2016-06-30
- Inventor: Liang WANG , Rajesh KATKAR , Hong SHEN , Cyprian Emeka UZOH
- Applicant: Invensas Corporation
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34 ; H05K3/40 ; H05K1/11
Abstract:
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
Public/Granted literature
- US09888584B2 Contact structures with porous networks for solder connections, and methods of fabricating same Public/Granted day:2018-02-06
Information query
