Invention Application
US20160192496A1 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME 有权
具有用于焊接连接的多孔网络的接触结构及其制造方法

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME
Abstract:
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
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