Invention Application
- Patent Title: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Patent Title (中): 制造半导体器件的方法
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Application No.: US15077937Application Date: 2016-03-23
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Publication No.: US20160204230A1Publication Date: 2016-07-14
- Inventor: Hsiang-Chen Lee , Ping-Chia Shih , Chi-Cheng Huang , Wan-Fang Chung , Yu-Chun Chang , Je-Yi Su
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/033 ; H01L21/02 ; H01L21/28 ; H01L27/115

Abstract:
A method for fabricating semiconductor device is disclosed. Preferably, two hard masks are utilized to define the width of the first gate (may serve for a control gate) and the width of the second gate (may serve for a select gate). The widths are thus well controlled. For example, in an embodiment, the width of the select gate may be adjusted in advance as desired, and the select gate is protected by the second hard mask during an etch process, so as to obtain a select gate which upper portion has an appropriate width. Accordingly the semiconductor device would still have an excellent performance upon miniaturization.
Public/Granted literature
- US09397202B1 Method for fabricating semiconductor device Public/Granted day:2016-07-19
Information query
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