发明申请
US20160211235A1 BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE HAVING THE SAME
有权
BUMP结构，半导体器件和具有它们的半导体器件封装
- 专利标题： BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE HAVING THE SAME
- 专利标题（中）： BUMP结构，半导体器件和具有它们的半导体器件封装
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申请号： US14599366申请日： 2015-01-16
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公开(公告)号： US20160211235A1公开(公告)日： 2016-07-21
- 发明人: Dao-Long CHEN , Ping-Feng YANG , Chang-Chi LEE , Chien-Fan CHEN
- 申请人： Advanced Semiconductor Engineering, Inc.
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
The present disclosure relates to bump structures and a semiconductor device and semiconductor device package having the same. The semiconductor device includes a body, at least one conductive metal pad and at least one metal pillar. The body includes a first surface. The at least one conductive metal pad is disposed on the first surface. Each metal pillar is formed on a corresponding conductive metal pad. Each metal pillar has a concave side wall and a convex side wall opposite the first concave side wall, and the concave side wall and the convex side wall are orthogonal to the corresponding conductive metal pad.
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